Download Adhesives Technology for Electronic Applications. Materials, by James J. Licari PDF

By James J. Licari

  • "I suggest this publication with out reservation to each person in electronics who needs to comprehend adhesives, or make judgements approximately adhesives, or both." - George Riley

Content:
Preface

, Pages vii-viii
Acknowledgements

, Pages ix-x
1 - Introduction

, Pages 1-37
2 - capabilities and concept of Adhesives

, Pages 39-94
3 - Chemistry, formula, and homes of Adhesives

, Pages 95-168
4 - Adhesive Bonding Processes

, Pages 169-260
5 - Applications

, Pages 261-346
6 - Reliability

, Pages 347-391
7 - attempt and Inspection Methods

, Pages 393-430
Appendix

, Pages 431-439
Index

, Pages 441-457

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Additional resources for Adhesives Technology for Electronic Applications. Materials, Processes, Reliability

Example text

Eq. 3) Wa = γlv (1 + cos θ) The spreading coefficient or work function (Wa ) in Eq. 3) shows that good wetting (θ < 90°) is realized when Wa is greater than zero. Good wetting also requires using a liquid having a high surface tension. 3) also show that high surface tensions of adhesives as liquids require high surface energies of the surfaces to be bonded to produce low contact angles and good wettability. The surface tension of most epoxies is approximately 80 dynes/cm. [9] Contact angles are modified for rough surfaces.

22). 7% from 2003 through 2008. The total dollar value of adhesives is predicted to increase from $259 million in 2003 to $650 million in 2013. Adhesives for electronics comprise approximately 10% of the total market for polymeric materials used in electronics. 22. � Dietz, R. , New Die Attach Material For Hermetic Packaging, Proc. Mfg. , Handbook of Epoxy Resins, Ch. � Galloway, D. , Reliability of Novel Die Attach Adhesive for Snap Curing, Proc. , Novel Snap Cure Die Attach for In-Line Processing, Solid State Technol.

Hydrogen atoms bond strongly to highly electronegative atoms such as fluorine, oxygen, nitrogen, and sulfur. 10. Proposed mechanism for adhesion promotion using a silane. bonds with the oxide and hydroxyl groups of metal oxides present on metal and ceramic surfaces. Hydrogen bond interactions between epoxy adhesives and epoxy-laminate or other plastic-laminate circuit boards also result in strong adhesion. 11 shows the authors’ concept of the role that Hbonding plays in the adhesion of a partially cured epoxy to an oxide surface such as a silicon oxide layer on a silicon substrate or an aluminum oxide of an alumina ceramic.

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